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![[The the Loop Heat Pipe is barely thicker then a penny]](../images/LHPAssembly_UofC_sm.jpg)
The thickness of the Loop Heat Pipe compared to a penny
The University of Cincinnati, along with Texas A & M, Thermacore, GRC and
LaRC, has pioneered the macro-porous silicon
wet-etching process, and has performed preliminary testing to
demonstrate the concept of a silicon loop heat pipe wick. This
ability to fabricate a loop heat pipe in silicon would allow
a very small temperature drop between the die and the ultimate
heat sink, the radiator. Current radiators for space applications
typically operate at the box baseplate temperature, which is
near 25 °C. If a space-based radiator could operate at a
much higher temperature, say, at the temperature of a die (~
125 °C), the radiator weight savings would be substantial,
since thermal radiation heat transfer is a function of temperature
to the fourth power.
![[SEM of a CPS wafer with pore size of 2.6 nanometer, 4 nanometer spaced]](../images/LHPSlides_UofC_sm.jpg)
Last Revision: December 12, 2000
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