Thermal Management:

The Center for Space Power (CSP) is conducting commercially driven research programs for various advanced thermal management technologies. The Center, along with its industry and Government partners are advancing the selected technologies through microgravity based research.

Loop Heat Pipe:

Loop Heat Pipes (LHP) are two-phase thermal control systems similar to regular heat pipes but can transport higher thermal loads over greater distances. These devices have many applications both in space and here on Earth. The Loop Heat Pipe flight experiment recently flew aboard STS-87. The LHP flight experiment tested a version of this advanced thermal technology and validated its readiness for space applications.

Multi-Chip Module:

Multi-chip modules (MCMs) are advanced technologies that integrate the cooling system into the chip substrate. The integration allows improved cooling leading to higher power dissipation. This technology will allow for greater heat fluxes for MCM boards and single chips.

http://engineer.tamu.edu/tees/csp*

http://www.ne.tamu.edu/people/faculty/best/index.htm*

Last Revision: January 25, 2002

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Curator: Wayne A. Wong
  NASA Official Responsible For Content:  Richard K. Shaltens
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Last Updated: 07/31/2002