STABLCOR™ Performance Benefits: Low cost, thermally conductive constraining core for Printed Wiring Boards (PWB). High PWB thermal conductivity: 300% to 500% higher than non-cored PWBs. Tailored PWB CTE: ~3.8 ppm/degree C for "Flip chip on Board" FCOB, up to ~10 ppm/degree C for plastic packages High PWB stiffness: > 200% higher than non-cored PWBs. Adds no weight vs non-cored PWBs.

AMT's STABLCOR™ is a GRC SBIR success story. Decreasing the thermal resistance within a circuit board is key to enabling densely-packed power electronics. Generally, if higher watt-density can be achieved with little or no penalty, then weight of the power subsystem can be decreased. For NASA missions, weight is one of the critical performance parameters for electronics packaging.

Update July 2001:

SDC Circuits has formed a company called STABLCOR Inc. and they have given a license to a company called ThermalWorks that specializes in high density memory modules, for example 1 GB.

ThermalWorks Website*

Last Revision: March 20, 2002

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Curator: Wayne A. Wong
  NASA Official Responsible For Content:  Richard K. Shaltens
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Last Updated: 07/31/2002