Long description of figure 2

The filament is the spiral-shaped object enclosed by top and bottom wafer in this photograph. The top window is about 10 by 5 mm, and the bonded chips are set in a multipin mounting package.

Return to article

Last updated: June 25, 2003

Responsible NASA Official: Gynelle.C.Steele@nasa.gov
216-433-8258

Point of contact for NASA Glenn's Research & Technology reports: Cynthia.L.Dreibelbis@nasa.gov
216-433-2912
SGT, Inc.

Web page curator: Nancy.L.Obryan@nasa.gov
216-433-5793
Wyle Information Systems, LLC

NASA Web Privacy Policy and Important Notices