Return to articleA prototype high-temperature printed circuit board is being developed for these chip-level packages, which are made of aluminum nitride or alumina substrates. The printed circuit board shown is designed for testing a single package or a packaged device or system at high temperatures. The same ceramic substrate and thick-film metalization materials as those used for packages are used for printed circuit boards. The aluminum nitride board surface may be passivated by appropriate encapsulate materials before screen-printing thick-film metalization traces. The board design shown in the figure includes four units. Each unit provides 12 input/output interconnections to connect the board to the outside. This printed circuit board is designed for a single chip or package test at high temperatures with printed-circuit-board-level interconnections.
Last updated: June 25, 2003
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