The diagram shows (1) EBC requirements for low thermal conductivity, water vapor stability, coefficient of thermal expansion match, phase stability, low modulus, sinter resistance, and crack resistance (low stress); (2) EBC interface with SiC/SiC requirements of adherence and chemical compatibility; (3) layer order: top-EBC, middle-SiC/SiC, bottom-CMC.
Last updated: June 25, 2003
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